APPLICATIONS / SYYN
Applications.
Start with the application, operating conditions and measurement objectives to define meaningful, comparable tests.
01 / APPLICATION
Chip Thermal Testing
Define the required test heat source and temperature feedback against the target chip's power distribution, hotspots and mounting conditions. The discussion focuses on how to configure the thermal load and which temperatures and thermal responses need to be measured.
02 / APPLICATION
Package Thermo-Mechanical Validation
Discuss temperature, package stress and warpage along the thermal path through the die, substrate and interface materials. For thermo-mechanical projects, the sensing configuration, loading conditions and validation objectives are defined before the test approach is agreed.
03 / APPLICATION
Cold Plate & Liquid Cooling Testing
Discuss cooling performance, thermal resistance and temperature uniformity under defined cold plate, heat source, flow rate and coolant inlet conditions. Agreed test conditions provide a basis for comparing cold plates and liquid cooling solutions.
04 / APPLICATION
TIM & Thermal Material Characterization
Discuss interface thermal performance and material comparisons under defined thickness, contact pressure and temperature conditions. Specialized evaluations, including ageing studies, require agreed samples, test duration, measurement methods and acceptance criteria.